| Customization: | Available |
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| Conductive Type: | Bipolar Integrated Circuit |
| Integration: | GSI |
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| Pin | Symbol | Description |
| A1-A5, B1-B5, C1-C4 | VOUT1 | Power output 1 pin. Connect the output load between VOUT1 and GND. A filter capacitor needs to be placed between VOUT1 and GND. |
| A6-A7, B6-B7, D1-D4, D9-D12, E1-E4, E10- E12, F1-F3, F10-F12, G1, G3, G10, G12, H1- H7, H9-H12, J1, J5, J8, J12, K1, K5-K8, K12, L1, L12, M1 , M12 |
GND |
Power ground pins for inputs and outputs. |
| A8-A12, B8-B12, C9-C12 | VOUT2 |
Power Output 2 pin. Connect the output load between VOUT2 and GND. A filter capacitor needs to be placed between VOUT2 and GND. |
C5, C8 |
VOUTS1, VOUTS2 | Output voltage sampling pin. This pin is internally connected via a resistor to the corresponding feedback pin (VFB1/2). This pin can be connected directly to the output (VOUT). When a remote sampling amplifier is used, it can be connected to the DIFFOUT pin. When used in parallel, connect either VOUTS1 and VOUTS2 to the DIFFOUT pin or the VOUT pin. This pin cannot be left open. |
| Pin | Symbol | Description |
| C6 | fSET | Frequency setting pin. This pin outputs 10μA of current. Connecting a resistor from this pin to GND will generate a voltage across the resistor that will determine the switching frequency. A DC voltage can also be connected to this pin to set the operating frequency. |
| C7, D6, G6-G7, F6-F7 | SGND | Signal ground pins. All weak signals for control are routed back to the module through this set of pins. In the application, a single connection is made to the GND terminal of the output capacitor. |
D5, D7 |
VFB1, VFB2 |
The input of the error amplifier for the corresponding channel. Inside the module, this pin is connected to VOUTS through a 60.4kΩ resistor. Resistors of different values are connected between this pin and GND to set different output voltages. When used in parallel, connect VFB1 and VFB2, and then connect a resistor to GND. |
| E5, D8 | TRACK1, TRACK2 | Output voltage tracking and soft-start pins. Each channel provides 1.3μA current. |
| E6, E7 | COMP1, COMP2 | Current control threshold and error amplifier compensation terminals. When used in parallel , connect E6 and E7. |
| E8 | DIFFP | Remote Sampling Error Amplifier In-Phase Input. Connect this pin to the remote sampling positive terminal of the output voltage. |
| E9 | DIFFN | Remote Sampling Error Amplifier Inverting Input. Connect this pin to the remote sampling GND terminal of the output voltage. |
| F4 | MODE_PLLIN | Operating mode selection and external phase synchronization detection pin. When this pin is connected to SGND, both channels are in forced continuous mode (FCC); when it is connected to the INTVCC pin, it is in pulse-hopping mode; and when it is left open, it is in pulse burst mode. See Application Information for details. |
| F5, F9 | RUN1, RUN2 | Enable control pin. Connecting a voltage of 1.2V or more will turn on the corresponding channel. |
| F8 | DIFFOUT | Internal remote sampling error amplifier output. Connects to VOUTS that use remote sampling channels. |
| G2, G11 | SW1, SW2 | Switching node for measurement. Can be connected to an R-C network to reduce or eliminate ringing, or can be left open. See application information for details. |
| G4 | PHASMD | Phase Adjustment Pin. Connected to SGND, INTVcc, or null, the corresponding CLOCK phase difference is 60°, 120°, or 90°, in that order. |
| G5 | CLKOUT | Clock output pin with phase control. Used for phase interleaving control when multiple modules are connected in parallel. |
| G9, G8 | PGOOD1, PGOOD2 | Output voltage status indication pin. When the output voltage exceeds ±10% of the rated value, this pin will be pulled to ground. |
| H8 | INTVCC | Internal 5V regulated output. It mainly supplies power for internal control circuits and gate driver circuits. Connect a 4.7μF low ESR ceramic chip capacitor between this pin and ground. When either RUN1 or RUN2 is active, INTVcc will also be active. |
| J6 | TEMP | NC. |
| J7 | EXTVCC | External power input pin. When the external input voltage is greater than 4.7V, the external input power function will be enabled. When the input voltage VIN is 5V, connect this pin to VIN. |
| M2-M11, L2-L11, J2-J4, J9-J11, K2- K4, K9-K11 |
VIN |
Power input pin. Connect the input voltage between VIN and GND. Requires a decoupling capacitor to be placed between VIN and GND. |
| Absolute Maximum Ratings | Condition | Minimum value | Nominal value | Maximum value | Unit |
| VIN | -0.3 | 16 | V | ||
| VOUT1, VOUT2, VOUTS1, VOUTS2 | -0.3 | 6 | V | ||
| PGOOD1, PGOOD2, RUN1, RUN2, INTVCC, EXTVCC |
-0.3 | 6 | V | ||
| VSW | -1 | 16 | V | ||
| DIFFP, DIFFN, DIFFOUT, PHASMD |
-0.3 | INTVCC | V | ||
| COMP1, COMP2, VFB1, VFB2 | -0.3 | 2.7V | V | ||
| Storage temperature | -55 | +125 | ºC | ||
| Input Characteristics | Condition | Minimum value | Nominal value | Maximum value | Unit |
| Input Voltage Range | 4 | 15 | V | ||
| Input surge current (startup) | IOUT = 0A, CIN = 22µF × 3, CSS = 0.1µF, COUT = 100µF × 3, VOUT1 = 1.5V, VOUT2 = 1.5V, VIN = 12V | 1.1 | A |
||
Input quiescent current |
VIN = 12V, VOUT = 1.5V, Burst mode | 3 | mA | ||
| VIN = 12V, VOUT = 1.5V, PSM mode | 15 | mA | |||
| VIN = 12V, VOUT= 1.5V, FCC mode | 65 | mA | |||
| VIN = 12V , Shutdown, RUN = 0 | 50 | mA | |||
| General Requirements | Condition | Minimum Value | Nominal Value | Maximum Value | Unit |
| Switching Frequency | 250 | 780 | KHz | ||
| Efficiency | 90 | % | |||
| Functionality | Condition | Minimum value | Nominal value | Maximum value | Unit |
| VRUN1, VRUN2 thresholds | go up | 1.1 | 1.25 | 1.40 | V |
| VRUN1HYS, VRUN2HYS | hysteresis loop | 150 |
mV |
| Output Characteristics | Condition | Minimum value | Nominal value | Maximum value | Unit |
| Output voltage | 0.6 | 1.8 | V | ||
| Linear Regulation | VOUT = 1.5V, VIN from 5V to 15V IOUT = 0A (each) | 0.01 | 0.025 | %/V | |
| Load Regulation | VIN = 12V, VOUT = 1.5V, 0A to 18A | 0.75 | 1 | % | |
| Output Ripple (per channel) | IOUT = 18A, COUT = 100µF ×3/ X7R/Ceramic, 470µF POSCAP, VIN = 12V, VOUT = 1.5V, Frequency = 450kHz |
30 | mV | ||
| Dynamic Load Response | 50-100%ILOAD , di/dt=2.5A/μs | 80 | mV | ||
| Structural Characteristics | Conditions | Minimum Value | Nominal value | Maximum value | Unit |
| Size (BGA) | Length | 15.8 | 16 | 16.2 | mm |
| Width | 15.8 | 16 | 16.2 | mm | |
| Height | 4.91 | 5.01 | 5.21 | mm | |
| weights | 2 | g | |||
| Environmental Adaptability | Condition | Minimum value | Nominal value | Maximum value | Unit |
| Operating temperature (operating junction temperature) | -40 | 125 | ºC | ||
| High temperature storage (ambient temperature) | +125ºC , 48h | 125 | ºC | ||
| High temperature operation (ambient temperature) | +85°C , 24h; Input low, standard and high pressure for 8h each; VIN =12V , VOUT =1.2V , IOUT =10A |
85 |
ºC | ||
| Low temperature storage (ambient temperature) | -55°C, 24h | -55 | ºC | ||
| Low temperature operation (ambient temperature) | -40°C , 24h; Input low pressure, standard pressure, high pressure each 8h |
-40 | ºC | ||
| Damp heat | High temperature and high humidity stage: 60ºC, 95%; Low temperature and high humidity stage: 30ºC, 95%; 10 cycles, each cycle is 24h. | 30 |
60 |
ºC | |
| Thermal shock | High temperature 125 ºC, low temperature -55 ºC, high and low temperature of an hour for a cycle, a total of 32 cycles of the test | -55 | 125 | ºC |
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